
RF module PCBs
These are PCBs used to transmit various data at high frequency. As they are used at high frequencies, the “transmission loss” of high-frequency signal becomes important.
We propose “low dielectric substrates” to provide PCBs with impedance control.
Features
- Suitable for applications such as advanced driver assistance systems (ADAS), communication devices, antennas, GPS, and mobile base stations.
- The design is specialized for the transmission of high-frequency signals. This minimizes signal attenuation and impact of noise, achieving in superior signal quality.
- Low-loss materials are used, reducing signal transmission loss and enabling highly efficient signal transmission. This improves the overall performance of the system.
- A shielded structure to prevent electromagnetic interference (EMI) is adopted, preventing external noise and interference. This ensures stable communication.
KYODEN’s Strengths
- We are capable of supporting low-profile copper foil and low dielectric constant/low dielectric loss tangent materials.
- We provide integrated support from design to simulation, PCB manufacturing, and component mounting.
- Our lineup of substrates is extensive. And we have experience in manufacturing. We have also received many UL certifications (EMC materials, Panasonic materials, Resonac materials, etc.).
- We have also adopted the back drilling method. Please contact us for inquiries from prototype to mass production.
- There are many buildup PCB structures, and low dielectric materials are suitable. Manufacturing with stable quality is possible because in-house production is supported.
- We can manufacture with hybrid structures such as fluorine substrate for the surface layer and FR-4 for the core layer (We have much experience with high Tg materials and middle Tg materials).
Main product uses
- Advanced driver assistance systems (ADAS)
- Communication equipment
- Antennas
- GPS
- Mobile base stations