Features

• Used in power electronics such as power conversion devices (transformers) and electric vehicles.
• Achieves high current capacity, high thermal conductivity, and low current resistance. Enables higher power transmission efficiency and signal stability.
• By increasing the thickness of the copper, the current capacity of the pattern increases, and the expansion of the pattern width can be suppressed, enabling more compact devices (with smaller areas).

KYODEN’s Strengths

• We always have a wide range of base substrates in stock, including copper foil with thicknesses of 18μ, 35μ, 70μ, 105μ, and 175μ.
• Placement is possible on both inner and outer layers (subject to consultation).
• Thick copper foil of up to a maximum of 6oz (210µ) can be supported.
• Symbol printing on outer layer thick copper circuits is possible using high-precision silk printing thanks to support for inkjet printing.
• We can manufacture as many as you want, from prototype quantities to mass production.

Cross-sectional observation (x200)

Main product uses

• Power electronics devices such as power conversion devices (transformers) and electric vehicles