From the short lead-time manufacture of a single board to the manufacture of PCB products in small and medium-sized lots, we
respond to the demands of customers with a diverse lineup of products centered around buildup PCBs and multilayer PCBs.

• Diverse Product Lines

  • Single-sided/Double sided PTH PCBs

    We make PCBs that have circuit wiring installed on a single side or both sides of the epoxy resin
    surface. For Double sided PTH PCBs, the front and rear sides are connected via processing (hole drilling).
    KYODEN can deliver products in a minimum lead-time of 1 day.

    

  • Multilayer PCBs

    In multilayer PCBs, copper circuit wiring is formed on the epoxy resin surface and multiple layers
    are adhered by heating.
    We can manufacture a wide variety of multilayer PCBs comprising between 4 and 54 layers,
    board thickness of 0.5mm-6.3mm, and various impedance control specifications.

    

    The table on the right shows
    specifications (reference) including
    board thickness and substrate
    materials corresponding to the
    number of layers. We can respond
    to customized requests,
    so please feel free to inquire.

    

  • IVH PCBs

    Whereas conventional via processing penetrates the PCB,
    IVH is a method for manufacturing multilayer PCBs by using vias that connect only specific layers.
    Because the vias do not appear on the other layers,
    it is possible to increase the degree of circuit integration.

    

  • High-density interconnect (“HDI”)

    In these PCBs for transmitting high-frequency signals,
    we use substrate materials that entail little high-frequency loss and low conductivity.
    Since the Tg, etc. differs from conventional FR-4 substrate material, special controls
    and equipment such as plasma washing machines, etc. are required in manufacturing.
    Ceramic (alumina) and Teflon materials are also used, among others.

    

    HDI Any Layer PCBs

    Featuring a combination of laser technology, filled plating technology, etc.
    capable of ultrafine processing, these PCBs permit flexible connections across all layers.
    Because these PCBs enable a high degree of design flexibility and integration, they are ideally suited to increasing
    needs for smaller and thinner high-performance devices such as smartphones.

    

  • Microwave PCBs

    In these PCBs for transmitting high-frequency signals,
    we use substrate materials that entail little high-frequency loss and low conductivity.
    Since the Tg, etc. differs from conventional FR-4 substrate material,
    special controls and equipment such as plasma washing machines, etc. are required in manufacturing.
    Ceramic (alumina) and Teflon materials are also used, among others.

    

    Mechanical back-drilling (minimal stub)

    Because through-holes along transmission lines cause signal quality to deteriorate in proportion
    to frequency, it is possible to reduce signal reflectivity and improve transmission line
    characteristics by removing through-hole excesses (stubs).

    

  • High-density PCBs

    We utilize the semi-additive method to manufacture ultrafine patterns.

    Peel strength of 10N/cm or higher

    By adopting UTC copper foil of 5μｍ as the primary coppering,
    stable peel strength is obtained irrespective of the type of substrate material,
    and abnormal precipitation of the gold plating caused by residual Pd is prevented.

    Adoption of via fill plating as electrolytic copper plating

    This makes it possible to suppress variations in plating thickness and respond to filled via requirements.

    Based on any layer stack structure and multistage buildup PCBs,
    we can respond to a wide variety of PCB needs ranging from
    double-sided boards to multilayer boards.

    

    Ultrafine pattern　L/S=40/40

    

    5-2-5 (Any layer) Buildup PCB cross section

  • Heat-dissipating PCBs

    As electronic components acquire increasingly higher performance and become more and more
    compact, the amount of generated heat increases. From the standpoint of maintaining performance
    and extending the service life of electronic devices, it is necessary to adopt heat-dissipating circuitry
    that releases the heat generated in components from the space to the pattern.
    We propose solutions to these challenges in the shape of heat-dissipating measures.

    

    Copper Paste Via Filling
    (heat conductivity 0.58~7.8W/mk)

    We can fill from small diameter vias of φ0.15. Moreover, our proprietary vacuum via filling technology can also adapt to the filling of bottomed vias.

    

    

    As electronic components acquire increasingly higher performance and become more and more compact, the amount of generated heat increases. From the
    standpoint of maintaining performance and extending the service life of electronic devices, it is necessary to adopt heat-dissipating circuitry that releases the heat
    generated in components from the space to the pattern. We propose solutions to these challenges in the shape of heat-dissipating measures.

  • Cupper Bump PCBs

    Available to form the bump(height 20μm~100μm) on the required position of circuit pattern

    

  • Flexible PCBs

    FPCs are PCBs in which the electric circuitry is arranged on a substrate material constructed by
    laminating a thin, soft, flexible, insulating base film (polyimide, etc.) with copper foil.
    Since these boards, including their wiring, are thin, flexible and can be freely bent, it is possible to
    make it possible to make smaller, lighter and thinner electronic devices and can be
    three-dimensionally fitted into very small gaps.

    

  In addition,
  we are advancing development of other special
  PCBs suited to a diverse range of technologies and uses.

  Go here for advanced technologies

• A Solid Lineup of Manufacturing Centers

  • Tohoku Factory

    Product lines

    Double-sided and multilayer PCBs

    Production capacity

    28,000㎡

    Main products

    Amusement machines, automotive devices, AV-related devices, battery dev

    

  • Nagano Factory

    Product lines

    Single layer-multilayer PCBs, High-density interconnect (“HDI”)

    Production capacity

    17,000㎡

    Main products

    Measurement devices, AV-related devices, telecommunications devices, electronic devices

    

  • Osaka Factory

    Product lines

    High-density interconnect (“HDI”), Double-sided and multilayer PCBs, flexible PCBs

    Production capacity

    17,000㎡

    Main products

    Optical devices, high-frequency devices, sensors

    

  • Thailand Factory

    Product lines

    Double-sided and multilayer PCBs capacity

    Production capacity

    130,000㎡

    Main products

    Automotive devices, OA-related and office equipment, home electronics and AV-related devices

    
  
  Here for inquiries.