KYODEN leverages its PCB solutions to handle 5,000 design projects a year. We can handle all types of PCB ranging from
single-side to multilayer types and also flexible PCBs. Moreover, because our services are not biased towards any particular
sector, we respond to orders in a wide range of fields including automotive, medical and industrial machines.
Our team of one hundred designers realize AW design with fast lead time in consideration of mass production efficiency.
We can make proposals based on assessment data that is made available precisely because we are manufacturers.

• PCB Design Layout

  Owned CAD

  Manufacturer	Tool
  Zuken	･CR-8000 Design Force ･CR-5000 Board Designer ･CR-5000 PWS
  Cadence	･Allegro PCB Design
  SIEMENS EDA	･Xpedition xPCB Layout ･PADS ･Valor NPI
  Altium	･Altium Designer

  • 

    Aviation,
    Aerospace,Defense

  • 

    Social Infrastructure /
    Energy

  • 

    Medical /
    Healthcare

  • 

    Machines /
    Robotics

  • 

    Measurement /
    Control

  • 

    AV /
    Broadcasting Device

  • 

    Autos /
    Transportation Machines

  • 

    Automatic /
    Service Devices

  • 

    Servers, PCs /
    Peripheral Devices

  • 

    Wired / Wireless
    Communication Device

  • 

    Disaster Prevention /
    Security

  • 

    Household Electrical
    Appliances

  We Also Handle Buildup Design

  

  

  

  As the pitch of devices becomes increasingly narrow, many customers are faced with wiring difficulties.
  In recent BGA/CSP, many of which have pitch of less than 0.4mm, wiring is difficult in through-type PCBs.

  Because KYODEN manufactures buildup boards, we have abundant experience in designing such PCBs.
  Buildup boards make it possible to achieve higher density mounting and more compact board size than IVH PCBs.

  • 

    IVH PCBs

    It is necessary to have layout with circuit blocks divided
    between rear and front, however, buildup PCBs make it
    possible to achieve more compact design by arranging the
    same block circuitry on the front and rear.

  • 

    HDI PCBs

    Because laser drilling forms via holes without
    penetrating the front and rear, vias can be terminated on the wiring layer.

  KYODEN can perform design that is suitable for high-speed signal transfer while avoiding stabs. As pitch becomes increasingly
  shorter in the latest devices, it is becoming more and more difficult to achieve this in general through-type PCBs.

  For example, taking the case of a BGA with 0.5mm pitch, on a buildup PCB,
  it is possible to form a pad-on via in the BGA land and draw a signal through this.

  Here for inquiries.

• Simulation

  • In development of electronic devices, one of the objectives of simulation is to
    “visualize things that are invisible to the eye”.
    Full-time engineers, who also have experience of PCB design,
    leverage various types of simulation to provide high-quality PCBs.

    

  • SI analysis

    Pre analysis

    Pre-design layer composition/topology examination Building of realistic guidelines
    Layout of main components / Arrangement and values of passive components / Wiring layers, wiring
    lengths and connection methods / Device drive strength / Slew rate / Setting of interior termination

    Post analysis

    Post-design guideline verification based on CAD data
    Timing verification / Via delay / X-transfer speed differential in inner and outer layers / Verification of
    AC and DC characteristics

    

  • PI analysis

    IR-Drop Analysis and Decoupling Analysis
    Power plane voltage drop prevention
    Optimization of bypass capacitor

    

  • Electromagnetic field analysis

    We leverage three-dimensional full-wave electromagnetic field analysis tools that use the finite
    element method to provide highly precise analytical solutions

    

  • EMI analysis

    Plane resonance analysis and EMI rule checking
    Resonance suppression between power source-GND
    Extract codified causes of EMI occurrence and take countermeasures

    

  • Owned EDA

    Manufacturer	Tool
    SIEMENS EDA	HyperLynx SI HyperLynx PI
    ANSYS	HFSS･ SI Option SpaceClaim
    NEC	DEMITASNX
    FloTHERM	FloTHERM PACK

  Here for inquiries.

• Noise Consulting

  In AI, 5G, IoT and other fields concerned with electronics,
  transferred signals are becoming faster and acquiring higher frequency.
  KYODEN offers assistance for resolving “noise” issues that cause concern to the engineers that
  work with such technologies.
  Have you ever experienced the following kinds of problems?

  
  • You are faced with
    high-speed signals/
    high-frequency fields
    that you have never
    experienced before
  • You cannot identify
    the source of noise.
  • You are faced with the need
    to take countermeasures
    from multiple angles.

  iNARTE EMC engineers offer noise consulting services.

  • Proposals can be made concerning circuit
    diagrams / artwork / components selection /
    mechanical design / housing, etc.
  • We can also provide consulting
    based on actual devices.