An Industry First! Contributions to Measures for Heat Dissipation in Power
Semiconductor and High Heat-dissipating High-frequency Components

※Survey by KYODEN

Development of a high heat-dissipating, high-frequency PCB
based on the high-speed thick copper plating method

This PCB is structured with high-speed thick copper plating filled directly underneath heat-dissipating components,
allowing the copper, which has high heat conductivity, to directly connect and dissipate heat below the circuit board.
In conventional PCBs, copper inlays and copper coins (Figure 1) were embedded in the board for the purpose of
dissipating heat. However, issues were presented in terms of mass productibility, PCB reliability and compatibility
with thin boards.
In response to these challenges, we have developed high-speed thick copper plating technology and succeeded in
making high heat-dissipating, high-frequency PCBs (Figure 2).

Since this product uses thick copper plating, shape and size can be freely set, making it possible to assemble buildup
layers that were previously difficult to achieve with aluminum boards and copper-base boards (Figure 3).
Moreover, this technology can also be applied to PCBs for thin plate components of 0.4mm or less, which cannot be
handled with a copper inlay, thereby contributing to heat dissipation in high heat-radiating components. It has thus
become possible to respond to needs for high frequency and high heat-dissipation in power amp and power
semiconductor components used in 5G/6G base stations.

KYODEN’s Development Track Record

Moreover, the superior characteristics of the thick copper plating structure have been verified in heat dissipation
simulations and verification experiments assuming various PCB structures (Figure 3 and Figure 4).