Features

• They are suitable for supporting the increase in the number of circuits accompanying the downsizing of packages.
• The multilayer structure minimizes signal interference, crosstalk, etc. That makes them suitable for applications such as improving transmission quality and high-speed communication.
• We can offer proposals for the desired layer structure through impedance control, IVH, and other increases in the number of layers.
• They are also suitable for reducing power loss by means such as arranging power supply layers and ground layers.

KYODEN’s Strengths

• We can deliver even multilayer PCBs in three days with KYODEN’s ultra-quick delivery manufacturing (Miracle support).
• We can support multilayer PCBs (20 layers or more), and have a track record of manufacturing over 10,000 items per year.
• We can support low dielectric and low-loss materials from Japan and overseas (Panasonic: MEGTRON, Resonac: LW, EMC, etc.).
• We provide integrated support from design to PCB manufacturing and component mounting. Manufacturing quality depends on pattern design, and our engineers are highly skilled and have a thorough understanding of our process capacities.
• UL certifications are available (We hold many. Please consult with us depending on the specifications.)

Track record in multilayer and high-aspect ratio PCBs (including development and prototyping)

Total	PCB thickness （mm）	Minimum hole diamete（mm）	Aspect ratio	Substrate used	UL certification
54 layers	6.30	Φ0.50	12.6	MCL-E-679	◯
40 layers	6.20	Φ0.50	12.4	R-1755S	◯
28 layers	5.20	Φ0.40	13.0	MCL-BE-67G （discontinued）	◯
24 layers	3.00	Φ0.25	12.0	R-5725	◯
24 layers	4.80	Φ0.30	16.0	ELC-4765	◯
22 layers	2.60	Φ0.30	8.7	R-5775	◯
20 layers	3.20	Φ0.25	12.8	R-1566	◯
16 layers	4.80	Φ0.50	9.6	R-1755S	◯
16 layers	2.30	Φ0.25	9.2	R-5775	◯

Main product uses

• Industrial equipment
• Communication equipment