Features

• Used in applications such as high-speed communication network equipment and data center equipment.
• The data transmission speed is extremely high, and the latest communication technology is supported. This enables rapid transfer of large volumes of data.
• The impact signal attenuation and noise can be minimized. This improves signal quality.
• By using low dielectric constant, low dielectric loss materials, the transmission characteristics of signals are optimized, achieving performance suitable for high-speed communication.

KYODEN’s Strengths

• We can support hybrid configurations (low-loss materials + general materials).
• We have experience in everything from all-low-dielectric/low-loss substrates to hybrid structures.
• We have manufacturing know-how for high-frequency signal processing and reducing interference and noise.
• We can assist you from product development and propose layer structures including substrates and via structures.
• We have network analyzers. And we can also support Gbps-band simulations at KYODEN.
• We have experience manufacturing with fluorine substrates.

Back-drilled multilayer PCBs

Through-holes in transmission lines are a factor that reduces signal quality in proportion to the frequency, and by removing the excess portion of the through-hole (stub), it is possible to reduce signal reflection and improve transmission line characteristics.

Main product uses

• High-speed communication network equipment
• Data center equipment